image processing package digitalmicrograph 3 81 (Gatan Inc)
97
Structured Review
Gatan Inc
image processing package digitalmicrograph 3 81
Image Processing Package Digitalmicrograph 3 81, supplied by Gatan Inc, used in various techniques. Bioz Stars score: 97/100, based on 12074 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/image+processing+package+digitalmicrograph+3+81/DigitalMicrograph+Software/pm18563161-274-19-24
Average 97 stars, based on 12074 article reviews
Image Processing Package Digitalmicrograph 3 81, supplied by Gatan Inc, used in various techniques. Bioz Stars score: 97/100, based on 12074 PubMed citations. ZERO BIAS - scores, article reviews, protocol conditions and more
https://www.bioz.com/product/image+processing+package+digitalmicrograph+3+81/DigitalMicrograph+Software/pm18563161-274-19-24
Average 97 stars, based on 12074 article reviews
image processing package digitalmicrograph 3 81 - by Bioz Stars,
2026-10
97/100 stars
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Modification:Article Title: Nanoscale holographic interferometry for strain measurements in electronic devices. Article Snippet: Strained silicon is now an integral feature of the latest generation of transistors and electronic devices because of the associated enhancement in carrier mobility.. Strain is also expected to have an important role in future devices based on nanowires and in optoelectronic components.. Different strategies have been used to engineer strain in devices, leading to complex strain distributions in two and three dimensions. Software:Article Title: Nanoscale holographic interferometry for strain measurements in electronic devices. Article Snippet: Strained silicon is now an integral feature of the latest generation of transistors and electronic devices because of the associated enhancement in carrier mobility.. Strain is also expected to have an important role in future devices based on nanowires and in optoelectronic components.. Different strategies have been used to engineer strain in devices, leading to complex strain distributions in two and three dimensions. |